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 MC34064, MC33064, NCV33064 Undervoltage Sensing Circuit
The MC34064 is an undervoltage sensing circuit specifically designed for use as a reset controller in microprocessor-based systems. It offers the designer an economical solution for low voltage detection with a single external resistor. The MC34064 features a trimmed-in-package bandgap reference, and a comparator with precise thresholds and built-in hysteresis to prevent erratic reset operation. The open collector reset output is capable of sinking in excess of 10 mA, and operation is guaranteed down to 1.0 V input with low standby current. The MC devices are packaged in 3-pin TO-226AA, 8-pin SO-8 and Micro8 surface mount packages. The NCV device is packaged in SO-8 and TO-226AA. Applications include direct monitoring of the 5.0 V MPU/logic power supply used in appliance, automotive, consumer and industrial equipment. * Trimmed-In-Package Temperature Compensated Reference * Comparator Threshold of 4.6 V at 25C * Precise Comparator Thresholds Guaranteed Over Temperature * Comparator Hysteresis Prevents Erratic Reset * Reset Output Capable of Sinking in Excess of 10 mA * Internal Clamp Diode for Discharging Delay Capacitor * Guaranteed Reset Operation with 1.0 V Input * Low Standby Current * Economical TO-226AA, SO-8 and Micro8 Surface Mount Packages
Input 2 (2) Reset 1 (1)
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TO-226AA P SUFFIX CASE 29 Pin 1. Reset 2. Input 3. Ground
1
2
3
8 1
SO-8 D SUFFIX CASE 751
8 1
Micro8 DM SUFFIX CASE 846A
PIN CONNECTIONS
Reset 1 Input 2 N.C. 3 Ground 4 (Top View) 8 N.C. 7 N.C. 6 N.C. 5 N.C.
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.
1.2 Vref
DEVICE MARKING INFORMATION
See general marking information in the device marking section on page 6 of this data sheet.
Gnd
3 (4)
= Sink Only Positive True Logic
Pin numbers adjacent to terminals are for the 3-pin TO-226AA package. Pin numbers in parenthesis are for the 8-lead packages. This device contains 21 active transistors.
Figure 1. Representative Block Diagram
(c) Semiconductor Components Industries, LLC, 2002
1
June, 2002 - Rev. 7
Publication Order Number: MC34064/D
MC34064, MC33064, NCV33064
MAXIMUM RATINGS
Rating Power Input Supply Voltage Reset Output Voltage Reset Output Sink Current (Note 2) Clamp Diode Forward Current, Pin 1 to 2 (Note 2) Power Dissipation and Thermal Characteristics P Suffix, Plastic Package Maximum Power Dissipation @ TA = 25C Thermal Resistance, Junction-to-Air D Suffix, Plastic Package Maximum Power Dissipation @ TA = 25C Thermal Resistance, Junction-to-Air DM Suffix, Plastic Package Maximum Power Dissipation @ TA = 25C Thermal Resistance, Junction-to-Air Operating Junction Temperature Operating Ambient Temperature MC34064 MC33064 NCV33064 Storage Temperature Range 1. ESD data available upon request. Symbol Vin VO ISink IF Value -1.0 to 10 10 Internally Limited 100 Unit V V mA mA
PD RqJA PD RqJA PD RqJA TJ TA
625 200 625 200 520 240 +150 0 to +70 -40 to +85 -40 to +125
mW C/W mW C/W mW C/W C C
Tstg
-65 to +150
C
ELECTRICAL CHARACTERISTICS (For typical values TA = 25C, for min/max values TA is the operating ambient temperature range that applies [Notes 3 and 4] unless otherwise noted.)
Characteristics COMPARATOR Threshold Voltage High State Output (Vin Increasing) Low State Output (Vin Decreasing) Hysteresis RESET OUTPUT Output Sink Saturation (Vin = 4.0 V, ISink = 8.0 mA) (Vin = 4.0 V, ISink = 2.0 mA) (Vin = 1.0 V, ISink = 0.1 mA) Output Sink Current (Vin, Reset = 4.0 V) Output Off-State Leakage (Vin, Reset = 5.0 V) Clamp Diode Forward Voltage, Pin 1 to 2 (IF = 10 mA) TOTAL DEVICE Operating Input Voltage Range Quiescent Input Current (Vin = 5.0 V) Vin Iin 1.0 to 6.5 - - 390 - 500 V mA VOL - - - ISink IOH VF 10 - 0.6 0.46 0.15 - 27 0.02 0.9 1.0 0.4 0.1 60 0.5 1.2 mA mA V V V VIH VIL VH 4.5 4.5 0.01 4.61 4.59 0.02 4.7 4.7 0.05 Symbol Min Typ Max Unit
2. Maximum package power dissipation limits must be observed. 3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Thigh = +70C for MC34064 4. Tlow = 0C for MC34064 -40C for MC33064 +85C for MC33064 -40C for NCV33064 +125C for NCV33064 5. NCV prefix is for automotive and other applications requiring site and change control.
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2
MC34064, MC33064, NCV33064
10 8.0 6.0 4.0 2.0 0 RL = 10 k to Vin TA = 25C VO , OUTPUT VOLTAGE (V) 5.0 4.0 3.0 2.0 1.0 0 RL = 10 k to Vin TA = 25C
VO , OUTPUT VOLTAGE (V)
0
2.0
4.0 6.0 Vin, INPUT VOLTAGE (V)
8.0
10
4.560
4.580
4.600 Vin, INPUT VOLTAGE (V)
4.620
4.640
Figure 2. Reset Output Voltage versus Input Voltage
Figure 3. Reset Output Voltage versus Input Voltage
4.630 V th, THRESHOLD VOLTAGE (V) 4.620 4.610 4.600 4.590 4.580 4.570 -55 -25 0 Lower Threshold Low State Output 25 50 75 100 125 RL = 10 k to Vin I in , INPUT CURRENT (mA) Upper Threshold High State Output
1.0 0.8 0.6 +85C 0.4 0.2 0 TA = +25C +85C -40C 4.0 6.0 8.0 10 TA = +25C -40C
0
2.0
TA, AMBIENT TEMPERATURE (C)
Vin, INPUT VOLTAGE (V)
Figure 4. Comparator Threshold Voltage versus Temperature
Figure 5. Input Current versus Input Voltage
2.0 V OL, OUTPUT SATURATION (V)
Vin = 4.0 V TA = 85C
TA = 25C
Reset 90% Vin
1.5
Vin = 5.0 V to 4.0 V RL = 10 k TA = 25C
TA = -40C
1.0
5.0 V 4.0 V Vin 5.0V 4.0V
10k Reset
0.5 10% 0 0 10 20 30 ISink, SINK CURRENT (mA) 40
REF
200 ns/DIV
Figure 6. Reset Output Saturation versus Sink Current
Figure 7. Reset Delay Time
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3
MC34064, MC33064, NCV33064
80 I F , FORWARD CURRENT (mA) Vin = 0 V TA = 25C 60
40
20
0
0
0.4
0.8 1.2 VF, FORWARD VOLTAGE (V)
1.6
Figure 8. Clamp Diode Forward Current versus Voltage
+ Power Supply -
2 (2) 1 (1) + 1.2 Vref 3 (4)
R Reset CDLY A time delayed reset can be accomplished with the addition of CDLY. For systems with extremely fast power supply rise times (<500 ns) it is recommended that the RCDLY time constant be greater than 5.0 ms. Vth(MPU) is the microprocessor reset input threshold. 1 tDLY = RCDLY In 1Vth(MPU) Vin Microprocessor Circuit
Figure 9. Low Voltage Microprocessor Reset
RH + Power Supply Iin 2 (2) 1 (1) + 1.2Vref 3 (4) VH 4.6 RH + 0.02 RL x 10-6 RL Reset
Microprocessor Circuit
Test Data VH (mV) 20 51 40 81 71 112 100 164 190 327 276 480 DVth (mV) 0 3.4 6.8 6.8 10 10 16 16 34 34 51 51 RH (W) 0 10 20 20 30 30 47 47 100 100 150 150 RL (kW) 0 1.5 4.7 1.5 2.7 1.5 2.7 1.5 2.7 1.5 2.7 1.5
DVth(lower) 340 RH
Where: RH 150 W Where: RL 1.5 W, 10 kW
Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been simplified and does not account for the change of input current Iin as VCC crosses the comparator threshold (Figure 4). An increase of the lower threshold DVth(lower) will be observed due to Iin which is typically 340 mA at 4.59 V. The equations are accurate to 10% with RH less than 150 W and RL between 1.5 kW and 10 kW.
Figure 10. Low Voltage Microprocessor Reset with Additional Hysteresis
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4
MC34064, MC33064, NCV33064
+ Power Supply -
1.0k 2 (2) 1 (1) + 1.2Vref 3 (4)
+ 2 (2) 1 (1) + 1.2Vref 3 (4) Solar Cells
Figure 11. Voltage Monitor
25mH Vin = 11.5 to 14.5V MPSW51A 470 4.7k 2 (2) 330 + 22 + 680 1.2k 1N756 1 (1) + 1.2Vref 3 (4) 470 1N5819 +
Figure 12. Solar Powered Battery Charger
VO = 5.0 V IO = 50 mA
Test Line Regulation Load Regulation Output Ripple Efficiency
Conditions Vin = 11.5 V to 14.5 V, IO = 50 mA Vin = 12.6 V, IO = 0 mA to 50 mA Vin = 12.6 V, IO = 50 mA Vin = 12.6 V, IO = 50 mA
Results 35 mV 12 mV 60 mVpp 77%
Figure 13. Low Power Switching Regulator
VCC RL MTP3055EL
4.6V 2 (2)
270
1 (1) + 1.2Vref 3 (4) Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above circuit. When the input signal is below the 4.6 V threshold of the MC34064, its output grounds the gate of the L2 MOSFET.
Figure 14. MOSFET Low Voltage Gate Drive Protection
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5
MC34064, MC33064, NCV33064
ORDERING INFORMATION
Device MC34064D-5 MC34064D-5R2 MC34064DM-5R2 MC34064P-5 MC34064P-5RA MC34064P-5RP MC33064D-5 MC33064D-5R2 MC33064DM-5R2 MC33064P-5 MC33064P-5RA MC33064P-5RP NCV33064D-5R2* NCV33064P-5RA* NCV33064P-5RP* TA = -40C to +125C 0C o 5C TJ = -40C to +85C 40C TA = 0C to +70C Operating Temperature Range Package SO-8 SO-8 Micro8 TO-226AA TO-226AA TO-226AA SO-8 SO-8 Micro8 TO-226AA TO-226AA TO-226AA SO-8 TO-226AA TO-226AA Shipping 98 Units / Rail 2500 Units/ Tape & Reel 4000 Units / Tape & Reel 2000 Units / Bag 2000 Units / Tape & Reel 2000 Units / Ammo Pack 98 Units / Rail 2500 Units / Tape & Reel 4000 Units / Tape & Reel 2000 Units / Bag 2000 Units / Tape & Reel 2000 Units / Ammo Pack 2500 Units / Tape & Reel 2000 Units / Tape & Reel 2000 Units / Ammo Pack
*NCV33064: Tlow = -40C, Thigh = +125C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control.
MARKING DIAGRAMS
SO-8 D SUFFIX CASE 751 8 3x064 ALYW5 1 1 123 x = 3 or 4 y = I or C A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week *This marking diagram also applies to NCV33064P. Micro8 DM SUFFIX CASE 846A 8 Ly50 AYW TO-226AA P SUFFIX CASE 29 MC3x0 * 64P-5 ALYWW
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MC34064, MC33064, NCV33064
PACKAGE DIMENSIONS
P SUFFIX PLASTIC PACKAGE CASE 29-11 (TO-226AA) ISSUE AL
A R P L
SEATING PLANE
B
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --0.250 --0.080 0.105 --0.100 0.115 --0.135 --MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --6.35 --2.04 2.66 --2.54 2.93 --3.43 ---
K
XX G H V
1
D J C SECTION X-X N N
DIM A B C D G H J K L N P R V
D SUFFIX PLASTIC PACKAGE CASE 751-07 (SO-8) ISSUE W
-X- A
8 5
B
1 4
S
0.25 (0.010)
M
Y
M
-Y- G C -Z- H D 0.25 (0.010)
M SEATING PLANE
K
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D G H J K M N S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244
N
X 45 _
0.10 (0.004)
M
J
ZY
S
X
S
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MC34064, MC33064, NCV33064
PACKAGE DIMENSIONS
DM SUFFIX PLASTIC PACKAGE CASE 846A-02 (Micro8) ISSUE E
-A-
K
-B-
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. DIM A B C D G H J K L MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 --1.10 0.25 0.40 0.65 BSC 0.05 0.15 0.13 0.23 4.75 5.05 0.40 0.70 INCHES MIN MAX 0.114 0.122 0.114 0.122 --0.043 0.010 0.016 0.026 BSC 0.002 0.006 0.005 0.009 0.187 0.199 0.016 0.028
PIN 1 ID
G D 8 PL 0.08 (0.003)
M
TB
S
A
S
-T-
SEATING PLANE
0.038 (0.0015) H
C J L
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-0031 Phone: 81-3-5740-2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative.
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MC34064/D


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